PRESS RELEASE – On the August 22, LG Innotek (CEO Moon, Hyuksoo) introduced that it’s going to associate with Ansys, the world’s high engineering simulation firm, to develop the applying of ‘Digital Twin’ expertise to all its processes.
‘Digital Twin’ is a expertise that replicates objects in a digital area to foretell the outcomes of potential real-life conditions by way of pc simulations. It’s heralded as a expertise able to fixing numerous industrial and social issues. Specifically, it’s being quickly deployed within the manufacturing trade as it could possibly cut back product growth time and prices.
Ansys is thought to own world-leading expertise and deployment expertise within the area of simulation utilizing 3D modeling, Synthetic Intelligence (AI), and Machine Studying (ML). By collaborating with Ansys, LG Innotek will have the ability to leverage its newest ‘Digital Twin’ options and simulation software program to construct a state-of-the-art ‘Digital Twin’ atmosphere.
In collaboration with Ansys, LG Innotek performed a trial utility of its ‘Digital Twin’ expertise to some growth and manufacturing processes and has achieved tangible outcomes. Sooner or later, the corporate plans to develop the applying of ‘Digital Twin’ to the event and manufacturing processes of its whole product vary, together with autonomous driving elements akin to car connectivity and sensing units.
Preliminary verification of designs utilizing digital simulation, decreasing growth time by 99%
LG Innotek is reaping the advantages of its ‘Digital Twin’ in R&D. After verifying designs in a digital atmosphere, the corporate makes use of the information to reduce the variety of checks that should be performed and the time it takes to conduct them.
It utilized ‘Digital Twin’ expertise to the event of package deal substrate (PS) merchandise for semiconductors, managing to cut back the event time by 99%.
Substrates require the minimization of ‘Warpage’ because of the warmth and stress to which they’re uncovered throughout manufacturing. That is achieved by way of a simulation course of that optimizes the mixture of the circuit design construction and supplies composition ratio. Utilizing digital simulation by way of 3D modeling, LG Innotek has diminished the time required to foretell the diploma of ‘Warpage’ of a single substrate from 11 days to three.6 hours.
Rising deployment of ‘Digital Twin’ to FC-BGA and digital element manufacturing processes, maximizing manufacturing competitiveness
LG Innotek has expanded the applying of ‘Digital Twin’ expertise to not solely product growth but additionally the FC-BGA (Flip-Chip Ball-Grid Array) manufacturing course of. Utilizing this expertise, the corporate has succeeded in halving the ramp-up interval (improve in manufacturing capability by enhancing yield within the early phases of mass manufacturing) by establishing optimum situations for the FC-BGA manufacturing gear.
Previously, the corporate needed to conduct tons of of checks to establish the optimum FC-BGA course of situations, which relied closely on money and time. Utilizing 3D modeling, it has replicated the FC-BGA manufacturing course of in a digital area.
Operating the method in a digital area permits the pc to visualise and establish issues that might happen with numerous course of gear. This makes it potential to meticulously optimize situations, such because the circulation of liquids, warmth, and air that can’t be measured inside such gear.
As well as, LG Innotek has managed to extend productiveness by actively utilizing ‘Digital Twin’ within the manufacturing technique of digital car elements. Since digital car elements have an extended product lifespan and are extremely weak to the climate, guaranteeing high quality and reliability is essential.
LG Innotek utilized ‘Digital Twin’ expertise to the soldering course of, which is a key course of for guaranteeing the reliability of digital car elements. The soldering course of was simulated in a digital area to foretell the time it takes for the solder to crack. By optimizing course of situations akin to the quantity of solder utilized and nozzle design to delay cracking as a lot as potential, the corporate plans to extend productiveness by 40% in comparison with the earlier course of.
“LG Innotek to turn out to be a ‘meta-manufacturing’ firm by advancing Digital Twin expertise”
By means of its partnership with Ansys, LG Innotek plans to quickly develop using ‘Digital Twin’ expertise to all product strains and processes, together with new development companies akin to car communication modules and LiDAR (mild detection and ranging) units.
Sooner or later, the corporate plans to develop using ‘Digital Twin’ expertise to clients and companions throughout the complete worth chain, from growth to manufacturing. Because of this, companions and clients will have the ability to collaborate on product design and simulate the effectivity of manufacturing processes on the digital ‘Digital Twin’ platform constructed by LG Innotek.
All the knowledge generated within the digital area might be collected in actual time and used to enhance product design and buyer processes. All knowledge from LG Innotek, its companions, and clients might be organically linked and shared in actual time, enabling systematic high quality management and environment friendly growth.
Moreover, AI might be utilized to the digital design and high quality course of verification to extend simulation velocity and accuracy. AI will study from the information collected by way of simulation to derive optimum options and assist decision-making by engineers. LG Innotek believes the productiveness positive factors might be multiplied by combining the strengths of virtualization and AI expertise.
LG Innotek Chief Know-how Officer S.David Roh mentioned, “The long run we envision at LG Innotek is meta-manufacturing, the place simulation outcomes from a digital area are linked to bodily manufacturing amenities and routinely result in precise manufacturing.” He added, “To this finish, we’ll quickly apply superior ‘Digital Twin’ expertise to the complete worth chain, together with R&D, manufacturing, and high quality management, to create differentiated buyer worth.”
